|Number of pages||10|
1.3 The methods defined in this practice are intended to reduce component outgassing rates to levels necessary to meet mission performance requirements of the contamination sensitive hardware. Times, temperatures, and configurations contained in this document have been found to provide satisfactory results. Experienced operators may find that other, similar times, temperatures and configurations have provided satisfactory results. If deviations from these criteria are deemed appropriate, they should be detailed in the bakeout report.
1.4 This practice describes three bakeout methods: Method A, using prescribed time and pressure criteria; Method B, using prescribed QCM stabilization rate criteria; and Method C, which measures the QCM deposition rate.
|English title||Standard Practice for Spacecraft Hardware Thermal Vacuum Bakeout|