Standard

IEC 60068-2-69:2017 en;fr

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

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  • This norm is withdrawn since 01-06-2019

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About norm

Status Withdrawn
Number of pages 110
Committee Halfgeleiders
Published on 01-03-2017
Language English, French
IEC 60068-2-69 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb).

Details

ICS-code 19.040
31.190
English title Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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