Amendment

NEN-EN-IEC 61190-1-3:2007/A1:2010 en

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Optional additions:

36,23

About norm

Status Current
Number of pages 12
Committee Halfgeleiders
Published on 01-10-2010
Language English

Details

ICS-code 31.190
Dutch title Bevestigingsmaterialen voor elektronische samenstellingen - Deel 1-3: Eisen voor elektronische kwaliteits soldeerlegeringen en vloeibare en niet-vloeibare solderen voor elektronische soldeertoepassingen
English title Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Changes

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