Standard

NEN-EN-IEC 61191-3:2017 en

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

105,44 114,93 Incl BTW

About norm

Status Current
Number of pages 20
Committee Halfgeleiders
Published on 01-09-2017
Language English
NEN-EN-IEC 61191-3 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Details

ICS-code 31.240
Dutch title Printplaatsamenstellingen - Deel 3: Groepsspecificatie - Eisen voor door gaten gestoken, gesoldeerde samenstellingen
English title Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Replaces

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