Norm

ASTM B885-09(2015)

Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

48,24

Over deze norm

Status Definitief
Aantal pagina's 3
Commissie B02.11
Gepubliceerd op 01-05-2015
Taal Engels

1.1 This test method defines a resistance probing test for detecting the presence of foreign matter on Printed Wiring Board (PWB) contacts or fingers that adversely affects electrical performance. This test method is defined specifically for such fingers coated with gold. Application of this test method to other types of electrical contacts or to fingers coated with other materials may be possible and desirable but may require some changes in fixturing, procedures, or failure criteria.

1.2 Practice B667 describes another contact resistance probe method that has more general application to electrical contacts of various materials and shapes. Practice B667 should be used for more fundamental studies. This test method provides a fast inspection method for printed wiring board fingers.

1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar will all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.

Details

ICS-code 31.180
Nederlandse titel Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
Engelse titel Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

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