Norm

ASTM D1867-13

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

54,27

Over deze norm

Status Definitief
Aantal pagina's 5
Commissie D09.07
Gepubliceerd op 01-11-2013
Taal Engels

1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Details

ICS-code 31.180
Nederlandse titel Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
Engelse titel Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

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