Over deze norm
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
1.2 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.
1.3 The procedures appear in the following sections:
|Engelse titel||Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards|