Norm

ASTM D5109 - 99(2004) en

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

  • Deze norm is ingetrokken sinds 01-11-2012

50,60 61,23 Incl BTW

Over deze norm

Status Ingetrokken
Aantal pagina's 8
Gepubliceerd op 10-10-1999
Taal Engels

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.

1.2 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.3 The procedures appear in the following sections:

Details

ICS-code 31.180
Engelse titel Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
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