Over deze norm
1.1 This test method covers a procedure for temperature and humidity cycling of a membrane switch or printed electronic device.
1.2 This test method is performed to evaluate the properties of materials used in the construction of membrane switch or printed electronic assemblies as they are influenced by the absorption and diffusion of moisture and moisture vapor. This is an accelerated environmental test, accomplished by the continuous exposure of the test specimen to high relative humidity at an elevated temperature. Absorption of moisture by many materials results in swelling, which destroys their functional utility, causes loss of physical strength, and changes in other mechanical properties. Insulating materials which absorb moisture may suffer degradation of their electrical properties.
1.2.1 Physical changes:
18.104.22.168 Differential contraction or expansion rates or induced strain of dissimilar materials.
22.214.171.124 Cracking of surface coatings.
126.96.36.199 Leaking of sealed compartments.
188.8.131.52 Deformation or fracture of components.
1.2.2 Chemical changes:
184.108.40.206 Separation of constituents.
220.127.116.11 Failure of chemical agent protection.
1.2.3 Electrical changes:
18.104.22.168 Changes in electronic and electrical components.
22.214.171.124 Electronic or mechanical failures due to rapid water of condensate formation.
126.96.36.199 Excessive static electricity.
1.3 This test method is not intended to be a thermal shock procedure; a ramp rate between temperature extremes should not exceed 2°C/min.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
|Engelse titel||Standard Test Method for Exposure of a Membrane Switch or Printed Electronic Device to Temperature and Relative Humidity|