Over deze norm
1.1 This practice describes methods for measuring the sheet electrical resistance of sputtered thin conductive films deposited on large insulating substrates, used in making flat panel information displays. It is assumed that the thickness of the conductive thin film is much thinner than the spacing of the contact probes used to measure the sheet resistance.
1.2 This standard is intended to be used with Test Method .
1.3 Sheet resistivity in the range 0.5 to 5000 ohms per square may be measured by this practice. The sheet resistance is assumed uniform in the area being probed.
1.4 This practice is applicable to flat surfaces only.
1.5 Probe pin spacings of 1.5 mm to 5.0 mm, inclusive (0.059 to 0.197 in inclusive) are covered by this practice.
1.6 The method in this practice is potentially destructive to the thin film in the immediate area in which the measurement is made. Areas tested should thus be characteristic of the functional part of the substrate, but should be remote from critical active regions. The method is suitable for characterizing dummy test substrates processed at the same time as substrates of interest.
1.7 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
|Nederlandse titel||Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method|
|Engelse titel||Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method|