Norm

IEC 60068-2-69:2017+A1:2019-CSV en;fr

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

335,69 406,18 Incl BTW

Over deze norm

Status Definitief
Aantal pagina's 226
Commissie Halfgeleiders
Gepubliceerd op 01-06-2019
Taal Engels, Frans
IEC 60068-2-69+A1 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb).

Details

ICS-code 19.040
31.190
Nederlandse titel Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Engelse titel Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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