Over deze norm
The purpose is to check the internal materials, construction and workmanship of film and hybrid integrated circuits. These examinations will normally be used prior to tapping or encapsulation to detect and eliminate the F and HFICs with internal defects that could lead to device failure in normal application. Other acceptance criteria may be agreed upon with the purchaser or supplier.
|Engelse titel||Semiconductor devices - Integrated circuits - Part 20: generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: requirements for internal visual examination|