Norm

IEC 60749-19:2003+A1:2010 en

Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 19: Afschuifsterkte

37,39

Over deze norm

Status Definitief
Aantal pagina's 10
Commissie Halfgeleiders
Gepubliceerd op 01-11-2010
Taal Engels
This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term “semiconductor die” should be taken to include passive elements). This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates.

Details

ICS-code 31.080.01
Nederlandse titel Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 19: Afschuifsterkte
Engelse titel Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Vervangt

Winkelwagen

Subtotaal:

Ga naar winkelwagen