Norm

IEC 61760-4:2015+A1:2018-CSV en

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

8,31 10,06 Incl BTW

Over deze norm

Status Definitief
Aantal pagina's 8
Commissie Halfgeleiders
Gepubliceerd op 01-03-2018
Taal Engels
IEC 61760-4:2015+A1:2018 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. This part of IEC 61760 extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to • semiconductor devices, • devices for flow (wave) soldering.

Details

ICS-code 31.190
Engelse titel Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
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