Norm

IEC 62483:2013 en

Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

191,11

Over deze norm

Status Definitief
Aantal pagina's 50
Commissie Halfgeleiders
Gepubliceerd op 01-09-2013
Taal Engels
This International Standard describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This International Standard does not apply to semiconductor devices with bottom-only terminations where the full plated surface is wetted during assembly (for example: quad-flat no-leads and ball grid array components, flip chip bump terminations). Adherence to this standard includes meeting the reporting requirements described in Clause 6.

Details

ICS-code 31.080.01
Engelse titel Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
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