Norm

IEC/PAS 62137-3:2008 en

Elektronische samenstellingtechnologie - Selectierichtlijnen van omgevings- en vastheidsbeproevingsmethoden voor soldeerverbindingen

  • Deze norm is ingetrokken sinds 10-11-2011

191,11

Over deze norm

Status Ingetrokken
Aantal pagina's 41
Commissie Halfgeleiders
Gepubliceerd op 01-11-2008
Taal Engels
This guidance describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material. The regions of the joints to be tested are shown in Figure 1. The test methods given here are applicable to evaluate the strength of joints of a component mounted on printed wiring board but not to test the mechanical strength of components themselves. The test conditions for accelerated tests (rapid temperature change and high temperature tests) may exceed the maximum allowable temperature range for a component. The lead-free solders have different properties from those of the conventional tin-lead eutectic solder. The reliability of soldered joints using lead-free solder may be reduced by the composition of the solder used, the shape of terminals and surface treatment. The factors affecting the joint reliability using Sn96,5Ag3Cu,5 solder are shown in Figure 2. This solder has the properties of higher melting temperature and harder than the tin-lead eutectic solder and the solid is not easily deformed. Consequently, the stress induced to the joint becomes higher than the tin-lead eutectic solder. These properties may induce break of a soldered joint by accelerated temperature changes, or mechanical stress.

Details

ICS-code 31.190
Nederlandse titel Elektronische samenstellingtechnologie - Selectierichtlijnen van omgevings- en vastheidsbeproevingsmethoden voor soldeerverbindingen
Engelse titel Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
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