Over deze norm
This PAS defines for circuit card assemblies (CCA) - a default method for those companies that require a pre-defined approach and - a protocol for those companies that wish to develop their own test methods. The default method (Section 4 of the PAS) is intended for use by electronic equipment manufacturers, repair facilities, or programs that, for a variety of reasons, may be unable to develop methods specific to their own products and applications. It is to be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing Lead-free (Pb-free) solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of AHP electronic equipment.
|Nederlandse titel||Procesmanagement voor de luchtvaart - Systemen voor luchtruim en verdediging die loodvrije soldeer bevatten - Deel 3: Prestaties voor systemen met loodvrij solderen|
|Engelse titel||Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes|