Norm

ISO/TS 10303-1618:2006 en

Industrial automation systems and integration - Product data representation and exchange - Part 1618: Application module: AP210 interconnect design for microwave

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Over deze norm

Status Definitief
Aantal pagina's 107
Commissie Informatie-integratie en interoperabiliteit
Gepubliceerd op 15-12-2006
Taal Engels
This part of ISO 10303 specifies the application module AP210 interconnect design for microwave. The following are within the scope of this part of ISO 10303: two dimensional layered interconnect substrate; configuration management data; design management data; three dimensional layered interconnect substrate; three dimensional molded interconnect substrate; material conductivity classification; as-routed connections; embedded components; test points; tolerance based cutout design; tolerance based cavity design; as-required connections; partially routed connections; pre-defined printed templates for design re-use; geometric properties for trace layout; geometric properties for pad taper layout; explicit definition of terminals of the interconnect substrate; explicit definition of cavities and cutouts of the interconnect substrate required for components; mapping between the explicit definition of terminals and internal design features; printed template definitions with terminals defined using boundary element method; printed template definitions with terminals defined with an edge; printed template definitions with terminals defined with a cross-section area; items within the scope of application module Chemical substance, ISO/TS 10303-1655; items within the scope of application module Connectivity allocation to physical network, ISO/TS 10303-1658; items within the scope of application module Design product data management, ISO/TS 10303-1628; items within the scope of application module Design specific assignment to interconnect usage view, ISO/TS 10303-1663; items within the scope of application module Device marking, ISO/TS 10303-1664; items within the scope of application module Interconnect 2d shape, ISO/TS 10303-1682; items within the scope of application module Interconnect module to assembly module relationship, ISO/TS 10303-1685; items within the scope of application module Interconnect non planar shape, ISO/TS 10303-1688; items within the scope of application module Layered interconnect module 2d design, ISO/TS 10303-1695; items within the scope of application module Layered interconnect module 3d design, ISO/TS 10303-1696; items within the scope of application module Layout macro definition, ISO/TS 10303-1701; items within the scope of application module Pre defined datum symbol, ISO/TS 10303-1734; items within the scope of application module Via component, ISO/TS 10303-1754.

Details

ICS-code 25.040.40
Nederlandse titel Industrial automation systems and integration - Product data representation and exchange - Part 1618: Application module: AP210 interconnect design for microwave
Engelse titel Industrial automation systems and integration - Product data representation and exchange - Part 1618: Application module: AP210 interconnect design for microwave

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