Norm

ISO/TS 10303-1754:2006 en

Industrial automation systems and integration - Product data representation and exchange - Part 1754: Application module: Via component

  • Deze norm is ingetrokken sinds 22-11-2013
  • Deze norm is niet direct leverbaar vanuit de NEN-shop.
    Wilt u dit product bestellen neemt u dan contact op met NEN-klantenservice: (015) 2 690 391 of klantenservice@nen.nl

Over deze norm

Status Ingetrokken
Aantal pagina's 40
Commissie Informatie-integratie en interoperabiliteit
Gepubliceerd op 15-12-2006
Taal Engels
This part of ISO 10303 specifies the application module Via component. The following are within the scope of this part of ISO 10303: blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed; cylinder vias, where the cross-section shape is constant; tapered vias, where the cross-section shape may vary as the vertical distance changes; stacked vias, where multiple bind and buried vias share the same x y position; filled vias, where material may be inserted into the via during realization processes, which are within the scope of application module Layered interconnect module design, ISO/TS 10303-1698; buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed; interfacial connections, also known as through hole vias, which have both ends exposed; items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684; items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.

Details

ICS-code 25.040.40
Nederlandse titel Industrial automation systems and integration - Product data representation and exchange - Part 1754: Application module: Via component
Engelse titel Industrial automation systems and integration - Product data representation and exchange - Part 1754: Application module: Via component

Winkelwagen

Subtotaal:

Ga naar winkelwagen