Norm

ISO/TS 10303-410:2006 en

Industrial automation systems and integration - Product data representation and exchange - Part 410: Application module: AP210 electronic assembly interconnect and packaging design

  • Deze norm is niet direct leverbaar vanuit de NEN-shop.
    Wilt u dit product bestellen neemt u dan contact op met NEN-klantenservice: (015) 2 690 391 of klantenservice@nen.nl

Over deze norm

Status Definitief
Aantal pagina's 149
Commissie Informatie-integratie en interoperabiliteit
Gepubliceerd op 15-12-2006
Taal Engels
This part of ISO 10303 specifies the application module AP210 electronic assembly interconnect and pacjaging design. The following are within the scope of this part of ISO 10303: The hierarchical description of the functionality of the electronic assembly or interconnect or devices that are used in an electronic assembly or interconnect; The hierarchical description of the functional objects that are combinations of one or more functional objects; The configuration management of the functional objects that are being developed concurrently; The configuration management of analytical models that are being developed concurrently; The explicit interface to analytic models that are used to define the behaviour of a functional object, a device, a physical object, an electronic assembly, or an interconnect; The description of the connection among the functional objects; The description of the connection among the devices used in the electronic assembly or interconnect; The description of the requirements for physical interconnection; The physical layout of the electronic assembly, including a description of the placement of the physical objects in the electronic assembly; The description of the bare interconnect, including the conductive and non-conductive materials and patterns; The functional and physical description of devices or physical objects, including material characteristics and composition; The functional usage and physical usage description of devices or physical objects, including material characteristics and composition; The functional and physical description of devices or physical objects realized as part of the interconnect, including material characteristics and composition; The functional usage and physical usage description of devices or physical objects realized as part of the interconnect, including material characteristics and composition; The description of the requirements and constraints on the design of the electronic assembly that assure product performance, incorporate quality, and enhance manufacturing process capabilities; The description of the requirements and constraints on the design of the interconnect that assure product performance, incorporate quality, and enhance manufacturing process cap. The configuration management of electronic assembly design descriptions; The configuration management of interconnect design descriptions.

Details

ICS-code 25.040.40
Nederlandse titel Industrial automation systems and integration - Product data representation and exchange - Part 410: Application module: AP210 electronic assembly interconnect and packaging design
Engelse titel Industrial automation systems and integration - Product data representation and exchange - Part 410: Application module: AP210 electronic assembly interconnect and packaging design

Winkelwagen

Subtotaal:

Ga naar winkelwagen