Norm

NEN-EN-IEC 60191-6-17:2011 en

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

153,97

Over deze norm

Status Definitief
Aantal pagina's 30
Commissie Halfgeleiders
Gepubliceerd op 01-05-2011
Taal Engels
This part of IEC 60191 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Details

ICS-code 31.080.01
Engelse titel Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

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