Norm

NEN-EN-IEC 60749-14:2003 en;fr

Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 14: Sterkte van afsluiters (loodbepaling)

49,85

Over deze norm

Status Definitief
Aantal pagina's 27
Commissie Halfgeleiders
Gepubliceerd op 01-11-2003
Taal Engels, Frans
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Details

ICS-code 31.080.01
Nederlandse titel Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 14: Sterkte van afsluiters (loodbepaling)
Engelse titel Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

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