Norm

NEN-EN-IEC 60749-15:2011 en

Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 15: Bestandheid tegen soldeertemperatuur van toestellen gemonteerd via door-en-door gaten

Volledig inclusief:

22,64

Over deze norm

Status Definitief
Aantal pagina's 10
Commissie Halfgeleiders
Gepubliceerd op 01-01-2011
Taal Engels
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements of semiconductors, the clauses of this standard apply.

Details

ICS-code 31.080.01
Nederlandse titel Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 15: Bestandheid tegen soldeertemperatuur van toestellen gemonteerd via door-en-door gaten
Engelse titel Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
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