Norm

NEN-EN-IEC 60749-21:2005 en

Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 21: Soldeerbaarheid

  • Deze norm is ingetrokken sinds 13-09-2011

108,02

Over deze norm

Status Ingetrokken
Aantal pagina's 20
Commissie Halfgeleiders
Gepubliceerd op 01-03-2005
Taal Engels
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

Details

ICS-code 31.080.01
Nederlandse titel Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 21: Soldeerbaarheid
Engelse titel Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
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