Over deze norm
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
|Nederlandse titel||Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 21: Soldeerbaarheid|
|Engelse titel||Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability|