Norm

NEN-EN-IEC 60749-21:2011 en

Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 21: Soldeerbaarheid

117,74

Over deze norm

Status Definitief
Aantal pagina's 26
Commissie Halfgeleiders
Gepubliceerd op 01-09-2011
Taal Engels
This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.

Details

ICS-code 31.080.01
Nederlandse titel Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 21: Soldeerbaarheid
Engelse titel Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Vervangt

Winkelwagen

Subtotaal:

Ga naar winkelwagen