Norm

NEN-EN-IEC 60749-25:2003 en;fr

Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 25: Temperatuurcirculatie

41,55

Over deze norm

Status Definitief
Aantal pagina's 25
Commissie Halfgeleiders
Gepubliceerd op 01-11-2003
Taal Engels, Frans
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Details

ICS-code 31.080.01
Nederlandse titel Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 25: Temperatuurcirculatie
Engelse titel Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Winkelwagen

Subtotaal:

Ga naar winkelwagen