Norm

NEN-EN-IEC 60749-6:2017 en

Halfgeleiderelementen - Mechanische en klimatologische beproevingsmethoden - Deel 6: Opslag bij hoge temperaturen

9,06 10,96 Incl BTW

Over deze norm

Status Definitief
Aantal pagina's 8
Commissie Halfgeleiders
Gepubliceerd op 01-07-2017
Taal Engels
The purpose of NEN-EN-IEC 60749-6 is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure methods and time-to-failure of solid state electronic devices, including non-volatile memory devices (data-retention failure mechanisms). This test is considered non-destructive but should preferably be used for device qualification. If such devices are used for delivery, the effects of this highly accelerated stress test will need to be evaluated. Thermally activated failure mechanisms are modelled using the Arrhenius equation for acceleration, and guidance on the selection of test temperatures and durations can be found in IEC 60749-43..

Details

ICS-code 31.080.01
Nederlandse titel Halfgeleiderelementen - Mechanische en klimatologische beproevingsmethoden - Deel 6: Opslag bij hoge temperaturen
Engelse titel Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
Vervangt

Winkelwagen

Subtotaal:

Ga naar winkelwagen