Over deze norm
The purpose of NEN-EN-IEC 60749-9 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test. Many available solvents that could be used are either not sufficiently active, too stringent, or even dangerous to humans when in direct contact or when fumes are inhaled.
|Nederlandse titel||Halfgeleiders - Mechanische en klimatologische beproevingsmethoden - Deel 9: Duurzaamheid van de markering|
|Engelse titel||Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking|