Norm

NEN-EN-IEC 61188-5-3:2007 en

Printplaten en samenstellingen - Ontwerp en gebruik - Deel 5-3: Overwegingen met betrekking tot aansluitingen (soldeereilanden/-verbindingen) - Componenten met soldeerpastalood aan twee zijden

153,97

Over deze norm

Status Definitief
Aantal pagina's 29
Commissie Halfgeleiders
Gepubliceerd op 01-12-2007
Taal Engels
This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.

Details

ICS-code 31.180
31.190
Nederlandse titel Printplaten en samenstellingen - Ontwerp en gebruik - Deel 5-3: Overwegingen met betrekking tot aansluitingen (soldeereilanden/-verbindingen) - Componenten met soldeerpastalood aan twee zijden
Engelse titel Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

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