Norm

NEN-EN-IEC 61189-3-719:2016 en

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

40,76

Over deze norm

Status Definitief
Aantal pagina's 22
Commissie Halfgeleiders
Gepubliceerd op 01-04-2016
Taal Engels
NEN-EN-IEC 61189-3-719 specifies a test method to monitor the resistance of single platedthrough holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

Details

ICS-code 31.180
Nederlandse titel Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Engelse titel Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

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