Norm

NEN-EN-IEC 61189-5-3:2015 en

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

190,20

Over deze norm

Status Definitief
Aantal pagina's 79
Commissie Halfgeleiders
Gepubliceerd op 01-04-2015
Taal Engels
NEN-EN-IEC 61189-5-3 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.

Details

ICS-code 31.180
Nederlandse titel Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
Engelse titel Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

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