Norm

NEN-EN-IEC 61190-1-2:2014 en

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

135,85

Over deze norm

Status Definitief
Aantal pagina's 48
Commissie Halfgeleiders
Gepubliceerd op 01-06-2014
Taal Engels
NEN-EN-IEC 61190-1-2 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1.

Details

ICS-code 31.190
Nederlandse titel Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Engelse titel Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Vervangt

Winkelwagen

Subtotaal:

Ga naar winkelwagen