Norm

NEN-EN-IEC 61190-1-3:2018 en

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

217,37 263,02 Incl BTW

Over deze norm

Status Definitief
Aantal pagina's 86
Commissie Halfgeleiders
Gepubliceerd op 01-04-2018
Taal Engels
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Details

ICS-code 31.190
Engelse titel Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
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