Norm

NEN-EN-IEC 61760-1:2006 en

Oppervlaktemontagetechnologie - Deel 1: Standaardmethode voor de specificatie van onderdelen voor oppervlaktemontage (SMDs)

153,97

Over deze norm

Status Definitief
Aantal pagina's 91
Commissie Halfgeleiders
Gepubliceerd op 01-08-2006
Taal Engels
This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The object of this standard is to ensure that a wide variety of SMDs (passive and active) can be subjected to the same placement and mounting processes during assembly. This standard defines tests and requirements that need to be part of any SMD component general, sectional or detail specification. In addition, this standard provides component users and manufacturers with a reference set of typical process conditions used in surface mount technology. The main changes with regard to EN 61760-1:1998 concern: - requirements related to leadfree soldering; - extension of the scope to include also components mounted by gluing; - direct reference to EN 60068-2-58 for requirements on solderability and resistance to soldering heat; - classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.

Details

ICS-code 31.240
Nederlandse titel Oppervlaktemontagetechnologie - Deel 1: Standaardmethode voor de specificatie van onderdelen voor oppervlaktemontage (SMDs)
Engelse titel Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
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