Norm

NEN-EN-IEC 61760-2:1998 en;fr

Oppervlaktemontagetechnologie - Deel 2: Vervoers- en opslagomstandigheden van onderdelen voor oppervlaktemontage (SMD) - Handleiding

  • Deze norm is ingetrokken sinds 08-08-2007

14,96

Over deze norm

Status Ingetrokken
Aantal pagina's 9
Gepubliceerd op 01-06-1998
Taal Engels, Frans
Describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deteioration, and result in assembly problems such as poor solderability, delamination and "popcorning".

Details

ICS-code 31.020
Nederlandse titel Oppervlaktemontagetechnologie - Deel 2: Vervoers- en opslagomstandigheden van onderdelen voor oppervlaktemontage (SMD) - Handleiding
Engelse titel Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
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