Norm

NEN-EN-IEC 62047-18:2013 en

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

45,28

Over deze norm

Status Definitief
Aantal pagina's 16
Commissie Halfgeleiders
Gepubliceerd op 03-10-2013
Taal Engels
This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm. Thin films are used as main structural materials for Micro-electromechanical Systems (abbreviated as MEMS in this document) and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material fabrication by deposition, photolithography, and/ or nonmechanical machining test piece. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Details

ICS-code 31.080.99
Nederlandse titel Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Engelse titel Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

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