Over deze norm
This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm. Thin films are used as main structural materials for Micro-electromechanical Systems (abbreviated as MEMS in this document) and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material fabrication by deposition, photolithography, and/ or nonmechanical machining test piece. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
||Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials