Over deze norm
The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
||Oppervlaktemontagetechnologie - Klimatologische en levensduurbeproevingsmethoden voor solderen bij oppervlaktemontage - Deel 1-1: Treksterkte beproeving
||Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test