Norm

NEN-EN-IEC 62137-1-4:2009 en

Oppervlaktemontagetechnologie - Klimatologische en levensduurbeproevingsmethoden voor solderen bij oppervlaktemontage - Deel 1-4: Cyclische buigproef

45,28

Over deze norm

Status Definitief
Aantal pagina's 16
Commissie Halfgeleiders
Gepubliceerd op 01-03-2009
Taal Engels
The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Details

ICS-code 31.190
Nederlandse titel Oppervlaktemontagetechnologie - Klimatologische en levensduurbeproevingsmethoden voor solderen bij oppervlaktemontage - Deel 1-4: Cyclische buigproef
Engelse titel Surface mounting technolog - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

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