Over deze norm
||Informatie-integratie en interoperabiliteit
Product data representation and exchange: Application protocol: Electronic assembly, interconnect, and packaging design. The application protocol Electronic assembly, interconnect, and packaging design. Component Data, Electrical Design, Function, Die, PWB, PWA, PCB, PCA, MCM, Flex, Rigid, Flex-Rigid, Circuit Analysis, Thermal Design, Magnetic Design, Optical Design, Netlist, Assembly, Interconnect, Package, Part, Programmable Device, Embedded Circuit, Configuration Management, Fabrication Stackup Model, Fabrication Technology, Manufacturing Features, Mechanical Features, Mechanical Design, Simulation, Electronic Assembly, Tolerance, Requirements, Interconnect Substrate, Layout, Design Rule, Design Constraints, Template, Requirements, Electro-mechanical Design. ISO 1303-210:2010 specifies the use of ISO 10303 integrated resources that satisfy the information sharing requirement for design engineers, device design engineers, value added engineering data suppliers, design analysts, system engineers fabrication planning engineers, interconnect fabrication design engineers and manufacturing process planning engineers. The information is shared to transform the detailed desig of and requirements for either an assembly or an interconnect substrate into either a manufacturable description or an analysable description. Device data is shared to assure adequate product design and for source control purposes.
||Industrial automation systems and integration - Product data representation and exchange - Part 210: Application protocol: Electronic assembly, interconnect, and packaging design