Norm

NPR-IEC/PAS 62190:2001 en

Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices

24,93

Over deze norm

Status Definitief
Aantal pagina's 15
Commissie Halfgeleiders
Gepubliceerd op 01-02-2001
Taal Engels
Applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages which, because of obsorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices.

Details

ICS-code 31.080.01
Nederlandse titel Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices
Engelse titel Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices

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