Over deze norm
Applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages which, because of obsorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices.
||Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices