Norm

NPR-IEC/TR 60068-3-12:2014 en

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

72,46

Over deze norm

Status Definitief
Aantal pagina's 35
Commissie Halfgeleiders
Gepubliceerd op 01-10-2014
Taal Engels
NPR-IEC/TR 60068-3-12, which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances. Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes.

Details

ICS-code 19.040
Engelse titel Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
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